Intellectual Property India Publishes Patent Application for 'Multilayer Metallized Paper-Based Packaging Material' Filed by Societe Des Produits Nestle S. A.

MUMBAI, India, May 2 -- Intellectual Property India has published a patent application (202517019361 A) filed by Societe Des Produits Nestle S. A., Vevey, Switzerland, on March 4, for 'multilayer metallized paper-based packaging material.'

Inventor(s) include Bhattacharya, Abhijit; and Jukarainen, Jenni Irina.

The application for the patent was published on May 2, under issue no. 18/2025.

According to the abstract released by the Intellectual Property India: "The present invention is directed to a multi-layer metallized paper-based packaging material (1) comprising, from its outer side to its inner side: - a paper layer (2) having a grammage in the range of 30 to 120 g/m2, - at least one organic barrier layer (3) of a polymer selected wi...