Intellectual Property India Publishes Patent Application for 'Multi-Ring Release Load Reduction Method And Apparatus' Filed by The Boeing Company

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202414049831 A) filed by The Boeing Company, Arlington, U.S.A., on June 28, 2024, for 'multi-ring release load reduction method and apparatus.'

Inventor(s) include Bowen, Ty Philip.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "Ring releases systems and methods to disengage ring systems are disclosed. The ring release systems and the methods to disengage ring systems employ devices that provides for lowering the loads experienced by multi-ring mechanisms and thus mitigate potential hardware damage."

Disclaimer: Curated by HT Syndication....