Intellectual Property India Publishes Patent Application for 'Multi-Level Tunnel Structure Having Upper Tunnel And Lower Tunnel Connected, And Construction Method Therefor' Filed by Bt Corp.

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202537042697 A) filed by Bt Corp., Gwangju, Republic of Korea, on May 2, for 'multi-level tunnel structure having upper tunnel and lower tunnel connected, and construction method therefor.'

Inventor(s) include Park, Tae Jin.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a multi-level tunnel structure (MT) having an upper tunnel and a lower tunnel connected, and a construction method (M) therefor. To this end, the present invention comprises: an upper and lower tunnel formation step for, by using a tunnel boring mac...