MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202247061469 A) filed by Osaka Gas Co. Ltd.; and Asahi Kohsan Corporation, Osaka, Japan, on Oct. 28, 2022, for 'mounting method and removal method for heat insulation structure.'
Inventor(s) include Sumida Koichi; Chiba Hideyuki; and Nakamura Hideo.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Provided is a mounting method for a heat insulation structure capable of favorably insulating an object to be insulated and facilitating the work of mounting a heat insulation member. A recessed groove part (8) recessed in a circumferential direction fr...