Intellectual Property India Publishes Patent Application for 'Mold Organic Binder, And Molding Sand Composition And Mold Obtained Using Same' Filed by Asahi Yukizai Corporation

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202517038189 A) filed by Asahi Yukizai Corporation, Miyazaki, Japan, on April 21, for 'mold organic binder, and molding sand composition and mold obtained using same.'

Inventor(s) include Maeda, Hironobu.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "Provided is a mold organic binder that has an exceptional curing speed during molding and that yields a mold exhibiting exceptional strength. This mold organic binder is configured using triethylenediamine together with one or more resins that serve as a resin adhesion component, the one or more resin...