MUMBAI, India, May 2 -- Intellectual Property India has published a patent application (202547034276 A) filed by Henkel Ag And Co. Kgaa, Duesseldorf, Germany, on April 8, for 'moisture curable polyurethane hot melt adhesive composition.'
Inventor(s) include Luo Yizhong.
The application for the patent was published on May 2, under issue no. 18/2025.
According to the abstract released by the Intellectual Property India: "Provided is a moisture curable polyurethane hot melt adhesive composition comprising at least one polyurethane prepolymer obtained by reacting components comprising (A) a polyol mixture comprising: (a) at least one polyol which is liquid at room temperature (b) at least one crystalline polyester polyol having a melting poi...