Intellectual Property India Publishes Patent Application for 'Modular Manifold For Use With A Microfluidics Chip And Having Two-Way And Three-Way Plate Manifolds And Method Of Making The Same' Filed by Asco, L. P.

MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517057281 A) filed by Asco, L. P., Florham Park, U.S.A., on June 14, for 'modular manifold for use with a microfluidics chip and having two-way and three-way plate manifolds and method of making the same.'

Inventor(s) include Hoskins, Matthew, T.

The application for the patent was published on July 4, under issue no. 27/2025.

According to the abstract released by the Intellectual Property India: "A modular manifold having two-way and three-way plate manifolds and a method of making the same. The modular manifold is intended to replace the large array of valves (interconnected with tubing) typically needed in medical, industrial, or analytical appl...