Intellectual Property India Publishes Patent Application for 'Methods For Constructing Package Substrates With High Density' Filed by Advanced Micro Devices, Inc.

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517014226 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on Feb. 19, for 'methods for constructing package substrates with high density.'

Inventor(s) include Boyapati, Sri Ranga Sai; Kulkarni, Deepak Vasant; Swaminathan, Raja; Alam, Arsalan; and Wilkerson, Brett P.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "A disclosed method can include (i) positioning a first surface of a component of a semiconductor device on a first plated through-hole, (ii) covering, with a layer of dielectric material, at least a second surface of...