Intellectual Property India Publishes Patent Application for 'Methods, Devices, And Systems For Ue Initiated Network Slice Management At Service Enablement Layer' Filed by Convida Wireless, Llc

MUMBAI, India, Feb. 7 -- Intellectual Property India has published a patent application (202417072373 A) filed by Convida Wireless, Llc, Wilmington, U.S.A., on Sept. 25, 2024, for 'methods, devices, and systems for ue initiated network slice management at service enablement layer.'

Inventor(s) include Seed, Dale; Ly, Quang; Mladin, Catalina; and Liu, Lu.

The application for the patent was published on Feb. 7, under issue no. 06/2025.

According to the abstract released by the Intellectual Property India: "Methods, devices, and systems for UE-initiated network slice management at a service enablement layer are described herein. In one aspect, a method can include receiving, by a NSCE client of a user equipment (UE) and from a VAL client of...