MUMBAI, India, May 2 -- Intellectual Property India has published a patent application (202517034799 A) filed by Huntsman Advanced Materials (SWITZERLAND) Gmbh, Basel, Switzerland, on April 9, for 'method to avoid cracks in encapsulation of sharp edged inserts.'
Inventor(s) include Beisele Christian; Colliard Sophie; Costantino Stephan; and Cherkaoui Zoubair.
The application for the patent was published on May 2, under issue no. 18/2025.
According to the abstract released by the Intellectual Property India: "A method to encapsulate inserts with an encapsulation resin said method comprising: a. Applying on part or all of the surface of the insert a coating layer of a thermosetting material b. Curing the coating layer resulting from step a...