Intellectual Property India Publishes Patent Application for 'Method Of Transferring Patterned Micro-Led Die Onto A Silicon Carrier For Wafer-To-Wafer Hybrid Bonding To A Cmos Backplane' Filed by Apple Inc.

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517014394 A) filed by Apple Inc., Cupertino, U.S.A., on Feb. 19, for 'method of transferring patterned micro-led die onto a silicon carrier for wafer-to-wafer hybrid bonding to a cmos backplane.'

Inventor(s) include Brockman, Justin S; Ou, Fang; He, Lina; Sizov, Dmitry S; and Zhang, Lei.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "Optoelectronic structures and methods of formation are described. In an embodiment, an optoelectronic structure includes a backplane with a driving circuitry and an array of contact pads, and a device layer bo...