MUMBAI, India, Feb. 21 -- Intellectual Property India has published a patent application (202517001440 A) filed by Dow Silicones Corporation, Midland, U.S.A., on Jan. 7, for 'method of applying a sealant composition.'
Inventor(s) include Wang, Xiuyan; Guo, Yi; Hu, Qiang; Peng, Jiang; and Zeng, Zhiping.
The application for the patent was published on Feb. 21, under issue no. 08/2025.
According to the abstract released by the Intellectual Property India: "This relates to a method of applying a one-part tin catalysed room temperature vulcanisable (RTV) silicone composition onto a hot porous substrate at a temperature of at least 40?, by first applying a waterborne or solvent borne binder composition on the hot porous substrate at a temperat...