Intellectual Property India Publishes Patent Application for 'Method For Use In Call, Device, Chip System, And Storage Medium' Filed by Honor Device Co. Ltd.

MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202537103688 A) filed by Honor Device Co. Ltd., Guangdong, China, on Oct. 28, for 'method for use in call, device, chip system, and storage medium.'

Inventor(s) include Li, Haibo.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "The present application provides a method for use in a call, a device, a chip system, and a storage medium. The method is applied to a terminal device. First information in a first RRC reconfiguration message currently received from a first cell, and a first parameter and a value corresponding to the first parameter in a lo...