MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202537095453 A) filed by Towa Corporation, Kyoto, Japan, on Oct. 4, for 'method for producing resin molded article, molding mold and resin molding apparatus.'
Inventor(s) include Yoshida Yusuke; Onishi Yohei; Sunada Mamoru; and Morikami Atsushi.
The application for the patent was published on Nov. 14, under issue no. 46/2025.
According to the abstract released by the Intellectual Property India: "Provided is a method for producing a resin molded article, the method suppressing the occurrence of wrinkles in a mold release film during compression molding using the mold release film, and also suppressing the formation of resin projections that may drop...