MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517050512 A) filed by Avery Dennison Corporation, Mentor, U.S.A., on May 26, for 'method for patterning an adhesive layer.'
Inventor(s) include Bharadwaj, Rishikesh; Pandey, Vivek; Zhao, Zhouzhou; and Ly, Tien.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "This disclosure generally relates to patterning adhesives for use on rough substrates. More particularly, the disclosure relates to methods of patterning adhesives via a roll-to-roll process to promote super adhesion to rough substrates."
The patent application was internationally filed ...