Intellectual Property India Publishes Patent Application for 'Method For Multi-Phase Cooling Of High-Density Mechanical Assemblies' Filed by K. R. Mangalam University

MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123081 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 6, 2025, for 'method for multi-phase cooling of high-density mechanical assemblies.'

Inventor(s) include Dr. Kaushal Kumar; and Dr. Prabhakar Bhandari.

The application for the patent was published on Jan. 23, under issue no. 04/2026.

According to the abstract released by the Intellectual Property India: "The present invention relates to a method for multi-phase cooling of high-density mechanical assemblies through a thermally adaptive sequence of fluid-state transitions. A cooling medium circulates through a network of thermally coupled channels integrated within the asse...