Intellectual Property India Publishes Patent Application for 'Method For Manufacturing Medium Density Fiberboard (MDF) And High Density Fiberboard (HDF) Using Green Raw Material' Filed by Arpula Suri Babu; and Arpula Vasavi

MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202441011605 A) filed by Arpula Suri Babu; and Arpula Vasavi, Secunderabad, Telangana, on Feb. 20, 2024, for 'method for manufacturing medium density fiberboard (mdf) and high density fiberboard (hdf) using green raw material.'

Inventor(s) include Arpula Suri Babu; and Arpula Vasavi.

The application for the patent was published on Sept. 5, under issue no. 36/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to method of manufacturing MDF and HDF boards using green raw materials that include de-oiled bran, micro silica produced from rice husk ash and phenol formaldehyde as binding material in ...