Intellectual Property India Publishes Patent Application for 'Method For Laser Drilling Syringe Bore To Eliminate Tungsten Contamination' Filed by Corning Incorporated

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051371 A) filed by Corning Incorporated, Corning, U.S.A., on May 28, for 'method for laser drilling syringe bore to eliminate tungsten contamination.'

Inventor(s) include Abramov, Anatoli Anatolyevich; and O'Malley, Connor Thomas.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "Provided are embodiments of a method of forming a syringe barrel. In the method, a bore is drilled through a tip of the syringe barrel with a first laser to provide fluid communication with an interior cavity of the syringe barrel. The interior cavity is defined by ...