MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202537028981 A) filed by Pac Tech - Packaging Technologies Gmbh, Nauen, Germany, on March 27, for 'method and device for separating a semiconductor component from a carrier.'
Inventor(s) include Fettke, Matthias; and Kolbasow, Andrej.
The application for the patent was published on May 9, under issue no. 19/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a method for separating a semiconductor component (21) from a carrier (22), wherein the semiconductor component (21) is integrally bondedly held in a bonding plane (24) on a carrier (22) by means of a metal-containing bonding medium (23), comprisi...