Intellectual Property India Publishes Patent Application for 'Method, Mould, And Housing For Forming An Electronic Component Package' Filed by Besi Netherlands B. V.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517046012 A) filed by Besi Netherlands B. V., Duiven, Netherlands, on May 13, for 'method, mould, and housing for forming an electronic component package.'

Inventor(s) include Gal, Wilhelmus Gerardus Joseph; and Kersjes, Sebastianus Hubertus Maria.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to a method for forming an electronic component package, comprising steps of: providing and placing a housing on the carrier whereon the electronic component is mounted, as such that the electronic component is located in a...