MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417073867 A) filed by Barlinek Spolka Akcyjna, Kielce, Poland, on Sept. 30, 2024, for 'manufacturing method for multi-layer floor panels.'
Inventor(s) include Lasak, Grzegorz; and Hoffmann, Piotr.
The application for the patent was published on Jan. 31, under issue no. 05/2025.
According to the abstract released by the Intellectual Property India: "In a first pressing stage, constituting preliminary pressing, glued layers forming a single multi-layer floor panel (1) are pressed for a time between 5 and 50 seconds, until a physical, local joining of the layers is obtained allowing determination of the position of the sheets of solid wood constitut...