Intellectual Property India Publishes Patent Application for 'Manifold Systems, Devices, And Methods For Thermal Management Of Hardware Components' Filed by Seguente, Inc.

MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202427098126 A) filed by Seguente, Inc., Melbourne, U.S.A., on Dec. 12, 2024, for 'manifold systems, devices, and methods for thermal management of hardware components.'

Inventor(s) include Amalfi, Raffaele, Luca; Enright, Ryan; and Kim, John.

The application for the patent was published on Jan. 31, under issue no. 05/2025.

According to the abstract released by the Intellectual Property India: "Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers."

The patent ...