Intellectual Property India Publishes Patent Application for 'Lth And Svlc Hybrid Core Architecture For Lower Cost Component Embedding In Package Substrate' Filed by Advanced Micro Devices, Inc.

MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202417104055 A) filed by Advanced Micro Devices, Inc., Santa Clara, U.S.A., on Dec. 28, 2024, for 'lth and svlc hybrid core architecture for lower cost component embedding in package substrate.'

Inventor(s) include Boyapati, Sriranga Sai; Kulkarni, Deepak Vasant; and Swaminathan, Rajasekaran.

The application for the patent was published on March 7, under issue no. 10/2025.

According to the abstract released by the Intellectual Property India: "An apparatus and method for efficiently transferring information as signals through a silicon package substrate. A semiconductor fabrication process (or process) begins with a relatively thin package substrate...