MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417067811 A) filed by Zhejiang Sinopont Technology Co. Ltd., Zhejiang, China, on Sept. 8, 2024, for 'low-fluidity packaging adhesive film specially for heterojunction solar cell assembly and preparation method for same.'
Inventor(s) include Xin, Lingmin; Wang, Long; Yang, Jiacheng; and Cai, Qian.
The application for the patent was published on Jan. 31, under issue no. 05/2025.
According to the abstract released by the Intellectual Property India: "Disclosed in the present invention are a low-fluidity packaging adhesive film specially for a heterojunction solar cell assembly and a preparation method for same. The packaging adhesive film is prepare...