MUMBAI, India, July 5 -- Intellectual Property India has published a patent application (202517060257 A) filed by Shenzhen Shokz Co. Ltd., Guangdong, China, on June 24, for 'loudspeaker assembly and earphone.'
Inventor(s) include Zhu, Guangyuan; Zhang, Lei; and Qi, Xin.
The application for the patent was published on July 4, under issue no. 27/2025.
According to the abstract released by the Intellectual Property India: "Disclosed in the present application are a loudspeaker assembly and an earphone. The earphone comprises a housing assembly, a bone conduction mechanism module and an air conduction mechanism module, wherein the housing assembly is provided with an accommodating space; the bone conduction mechanism module is arranged in th...