MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517040657 A) filed by Besi Netherlands B. V., Duiven, Netherlands, on April 28, for 'lead forming device for forming an electronic component lead and a method for forming an electronic component lead.'

Inventor(s) include Schoenaker, Robertus Christina Johannes Maria.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "The invention relates to a lead forming device for forming an electronic component lead, comprising: two cooperating opposite tool parts relatively movable towards and away from each other; a first clamp half attached to one of the...