Intellectual Property India Publishes Patent Application for 'Layer Building Formwork Easy To Mount And Dismount Safely And Efficiently' Filed by Qingdao Keva Formwork Scaffold Co. Ltd.

MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202417089739 A) filed by Qingdao Keva Formwork Scaffold Co. Ltd., Jiaozhou, China, on Nov. 19, 2024, for 'layer building formwork easy to mount and dismount safely and efficiently.'

Inventor(s) include Yang, Zhanhui.

The application for the patent was published on June 6, under issue no. 23/2025.

According to the abstract released by the Intellectual Property India: "The present invention relates to the technical field of building formworks. Specifically disclosed is a layer building formwork easy to mount and dismount safely and efficiently. The formwork comprises an aluminum profile frame and plywood nested at the top of the inner cavity of the alu...