Intellectual Property India Publishes Patent Application for 'Layer 1 And Layer 2 Handover Procedures' Filed by Qualcomm Incorporated

MUMBAI, India, March 7 -- Intellectual Property India has published a patent application (202547017197 A) filed by Qualcomm Incorporated, San Diego, on Feb. 27, for 'layer 1 and layer 2 handover procedures.'

Inventor(s) include Yuan, Fang; Zhou, Yan; and Luo, Tao.

The application for the patent was published on March 7, under issue no. 10/2025.

According to the abstract released by the Intellectual Property India: "Aspects relate to handover of a user equipment (UE) from a first cell (e.g., an SpCell) to a second cell (e.g., an SpCell). In some examples, Layer 1 signaling and/or Layer 2 signaling may be used to handover the UE from the first cell to the second cell. In some examples, the handover may omit a random access channel (RACH) p...