MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202547096561 A) filed by Applied Materials, Inc., Santa Clara, U.S.A., on Oct. 7, for 'lamp housing braze improvement for semiconductor rapid thermal processing (rtp) chamber.'

Inventor(s) include Yang, Yao-Hung; Gadgil, Shantanu Rajiv; Rao, Kaushik; Le, Ngoc; and Olson, Jeffrey Donald.

The application for the patent was published on Nov. 7, under issue no. 45/2025.

According to the abstract released by the Intellectual Property India: "Embodiments of lamp housings for a process chamber are provided herein. In some embodiments, a lamp housing for a process chamber includes: a first plate having a plurality of first openings; a copper plate having a p...