MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079058 A) filed by Tactotek Oy, Oulunsalo, Finland, on Aug. 20, for 'interface assembly and method for manufacturing interface assembly.'
Inventor(s) include Keranen, Antti; Heikkinen, Mikko; Hanninen, Ilpo; Apilo, Palvi; Saaski, Jarmo; Simula, Tomi; Braysy, Vinski; Wuori, Topi; and Korhonen, Pasi.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An interface assembly (100 is disclosed herein which comprises a functional multilayer structure (20) that comprise a first substrate (22, 28), a molded material layer (26) on a first side of the...