MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417068041 A) filed by Honeywell International Inc., Charlotte, U.S.A., on Sept. 9, 2024, for 'integrated heat spreader.'
Inventor(s) include Hegde, Prashant; Selvaraj, Nishanth; and Selvan, Baskaran.
The application for the patent was published on Jan. 31, under issue no. 05/2025.
According to the abstract released by the Intellectual Property India: "A heat spreader includes a top surface opposite a bottom surface, a first cavity formed within and extending upwardly from the bottom surface, the first cavity having a depth, a second cavity formed within and extending upwardly from the bottom surface, the second cavity having a depth, and wherein ...