Intellectual Property India Publishes Patent Application for 'Integrated Bare Die Package And Related Fabrication Methods' Filed by Qualcomm Incorporated

MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202547034792 A) filed by Qualcomm Incorporated, San Diego, on April 9, for 'integrated bare die package and related fabrication methods.'

Inventor(s) include Hoo Yeng Kwan; Krefft Anna Katharina; and Topal Emre.

The application for the patent was published on May 9, under issue no. 19/2025.

According to the abstract released by the Intellectual Property India: "Integrated bare die packages and related fabrication methods are disclosed. To provide for the integration of a bare die filter (114(1) 114(3) 114(5)) into the bare die package while maintaining an acoustic cavity (116(1) 116(2)) for the bare die filter and conserving package size the bare die ...