MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202427069434 A) filed by Dexerials Corporation, Tochigi, Japan, on Sept. 13, 2024, for 'individual piece processing adhesive film method for manufacturing connecting structure and connecting structure.'
Inventor(s) include Tanaka Yusuke; and Tamagawa Shogo.
The application for the patent was published on Jan. 31, under issue no. 05/2025.
According to the abstract released by the Intellectual Property India: "Provided are an individual piece processing adhesive film capable of improving adhesive strength with respect to a substrate on which components are mounted a method for manufacturing a connecting structure and a connecting structure.???The indi...