Intellectual Property India Publishes Patent Application for 'In-Mold Sealing System To Assist With Vacuum Assisted Resin Transfer Molding' Filed by Tpi Technology, Inc.

MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517039389 A) filed by Tpi Technology, Inc., Scottsdale, U.S.A., on April 24, for 'in-mold sealing system to assist with vacuum assisted resin transfer molding.'

Inventor(s) include Salimi, Amirhossein; and Segala, Alexander.

The application for the patent was published on June 13, under issue no. 24/2025.

According to the abstract released by the Intellectual Property India: "An in-mold sealing system for sealing openings in a wind turbine blade mold, the system including a wind turbine blade mold having an interior surface configured to form a surface of the wind turbine blade, the interior surface of the mold having at least one opening therein...