MUMBAI, India, June 6 -- Intellectual Property India has published a patent application (202517021822 A) filed by Sentea, Gent, Belgium, on March 11, for 'improved light source integration.'
Inventor(s) include Spuesens Thijs; Bockstaele Ronny; and Verhaegen Karsten.
The application for the patent was published on June 6, under issue no. 23/2025.
According to the abstract released by the Intellectual Property India: "The invention provides amongst other aspects a silicon on insulator SOI device for receiving a light source device in a flip chip arrangement the device comprising from bottom to top: a support layer; a BOX buried oxide layer comprising BOX material; a BOX covering layer comprising a selective etch stop material; a cladding ...