Intellectual Property India Publishes Patent Application for 'Hydrogel Flap For Wound Healing And Method Of Fabrication Thereof' Filed by Indian Institute Of Technology

MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202321088094 A) filed by Indian Institute Of Technology, Gandhinagar, Gujarat, on Dec. 22, 2023, for 'hydrogel flap for wound healing and method of fabrication thereof.'

Inventor(s) include Mukesh Dhanka; Hitasha Vithalani; and Harshil Dave.

The application for the patent was published on June 27, under issue no. 26/2025.

According to the abstract released by the Intellectual Property India: "The present disclosure relates to a hydrogel flap designed for accelerated wound healing. The hydrogel flap comprises a base material a crosslinking agent that enhances the mechanical strength and stability of the therapeutics-encapsulated hydrogel flap, and an...