Intellectual Property India Publishes Patent Application for 'Housing Assembly For Use In A Heat Exchange System' Filed by Danfoss A/S

MUMBAI, India, Jan. 31 -- Intellectual Property India has published a patent application (202417103837 A) filed by Danfoss A/S, Nordborg, Denmark, on Dec. 27, 2024, for 'housing assembly for use in a heat exchange system.'

Inventor(s) include Pawlik, Jens; and Birkelund, Michael.

The application for the patent was published on Jan. 31, under issue no. 05/2025.

According to the abstract released by the Intellectual Property India: "The present invention pertain to a housing assembly for use in a heat exchange system. The housing assembly comprises an aluminium housing with at least two fluid ports, wherein each fluid port is connected to a bi-metal connector, wherein the bi-metal connector comprises an inner copper layer and an outer stai...