Intellectual Property India Publishes Patent Application for 'High Speed, Ruggedized Connector' Filed by Amphenol East Asia Electronic Technology (SHENZHEN) Co. Ltd.

MUMBAI, India, May 16 -- Intellectual Property India has published a patent application (202517016438 A) filed by Amphenol East Asia Electronic Technology (SHENZHEN) Co. Ltd., Guangdong, China, on Feb. 2, for 'high speed, ruggedized connector.'

Inventor(s) include Maddens, Koen; He, Danren; and Shen, Jianqiang.

The application for the patent was published on May 16, under issue no. 20/2025.

According to the abstract released by the Intellectual Property India: "A modular connector that economically provides high signal integrity in a harsh environment, such as an automobile. The connector may include structures that provide precise and stable positioning of conductors with respect to ground structures, even for press fit connectors in wh...