MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517050896 A) filed by Alfa Laval Corporate Ab, Lund, Sweden, on May 27, for 'heat transfer plate.'
Inventor(s) include Nilsson, Johan.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "A heat transfer plate (1, 2, 4, 6, 12) comprises a first port hole area (A1) and an outer edge portion (35) comprising outer corrugations (37) extending between and in first and second planes (P1, P2). The first port hole area (A1) comprises a first port hole (43) defined by an annular first port edge (45), an annular first ring gasket groove (47) extending on th...