MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202517093478 A) filed by Gunze Limited, Kyoto, Japan, on Sept. 29, for 'heat-shrinkable film.'
Inventor(s) include Watanabe, Nobuhiro; and Takaichi, Jun.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "This heat-shrinkable film comprises a first surface layer, a second surface layer, and an intermediate layer. The intermediate layer is formed between the first surface layer and the second surface layer. The intermediate layer contains a first impact-resistant polystyrene and a second impact-resistant polystyrene. The first impact-resistant polys...