MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202547093822 A) filed by Matsumoto Yushi-Seiyaku Co. Ltd., Osaka, Japan, on Sept. 30, for 'heat-expandable microspheres and use thereof.'
Inventor(s) include Meshizuka, Tomohiro.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "The purpose of the present invention is to provide heat-expandable microspheres capable of yielding a molded article that does not tend to deform over the long term, and the use of the heat-expandable microspheres. The present invention is heat-expandable microspheres comprising a shell that contains a thermoplastic resin ...