MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202534032494 A) filed by Fosys Co. Ltd., Incheon, Republic of Korea, on April 2, for 'forming apparatus for semiconductor package lead.'
Inventor(s) include Lee, Hoon; and Hong, Ki Gon.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to an improved semiconductor package lead forming apparatus in which an angular cam punch performs a reciprocating motion along an operation section and an inclined hole of a cap holder in an elastically supported state, such that the lead is bent against a forming die while forming pre...