MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202527017569 A) filed by Honor Device Co. Ltd., Guangdong, China, on Feb. 27, for 'folding assembly and foldable electronic device.'
Inventor(s) include Yu, Dengpan; Zhang, Yaolei; Li, Qiancheng; and Guo, Renwei.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "Embodiments of the present application provide a folding assembly and a foldable electronic device. A base body is arranged between a first machine body and a second machine body; the base body comprises a first surface facing a bending part of a display screen of the foldable electronic...