Intellectual Property India Publishes Patent Application for 'Foam Particle, And Foam Particle Molded Article' Filed by Jsp Corporation

MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517016320 A) filed by Jsp Corporation, Tokyo, on Feb. 25, for 'foam particle, and foam particle molded article.'

Inventor(s) include Yamasaki Shobu; and Ito Yosuke.

The application for the patent was published on March 14, under issue no. 11/2025.

According to the abstract released by the Intellectual Property India: "This foam particle contains a polypropylene resin as the base resin and a hindered amine. The crystallinity of the polypropylene resin is not greater than 45%, the hindered amine compound has the structure given by formula (I), and the content of the hindered amine compound in the foam particle is 0.01 mass% to 4 mass%. (In formula...