MUMBAI, India, March 15 -- Intellectual Property India has published a patent application (202517015216 A) filed by Robert Bosch Gmbh, Stuttgart, Germany, on Feb. 21, for 'fluid-permeable cooler for cooling a power module.'
Inventor(s) include Breitenbach, Marlies; Beck, Max Florian; Paehrisch, Maik; and Hoppe, Tobias.
The application for the patent was published on March 14, under issue no. 11/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a fluid-permeable cooler (100) for cooling a power module (208) that comprises a power substrate. The fluid-permeable cooler (101) comprises a first metal part (101), a second metal part (102) and a cooling structure (1). The first metal ...