Intellectual Property India Publishes Patent Application for 'Enhanced Bonding System For Rcc Structural Joints Using Moisture-Indexed Silane Primer And Polymer-Modified Bond Coat With Objective Readiness Testing' Filed by B V Raju Institute Of Technology

MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541125651 A) filed by B V Raju Institute Of Technology, Narsapur, Telangana, on Dec. 12, 2025, for 'enhanced bonding system for rcc structural joints using moisture-indexed silane primer and polymer-modified bond coat with objective readiness testing.'

Inventor(s) include Mr. S. J Shivaraj; Mr. Sourabh Varma; Ms. Gandham Gnanasaru Deepika; Ms. Nomula Preethi; and Mr. B. Mohan Krishna.

The application for the patent was published on Jan. 2, under issue no. 01/2026.

According to the abstract released by the Intellectual Property India: "The present invention relates to a field-deployable and cost-effective bonding system for RCC structural joints us...