Intellectual Property India Publishes Patent Application for 'Encapsulant-Defined Land Grid Array Lga Package And Method For Making The Same' Filed by Deca Technologies USA, Inc.

MUMBAI, India, July 25 -- Intellectual Property India has published a patent application (202517062893 A) filed by Deca Technologies USA, Inc., Tempe, U.S.A., on July 1, for 'encapsulant-defined land grid array lga package and method for making the same.'

Inventor(s) include Davis, Robin; Bishop, Craig; Hoffman, Paul R; and Sandstrom, Clifford.

The application for the patent was published on July 25, under issue no. 30/2025.

According to the abstract released by the Intellectual Property India: "A method and related structure for a encapsulant defined land grid array (LGA) may comprise a semiconductor chip comprising conductive studs disposed over an active layer of the semiconductor chip, and a first encapsulant disposed around at least...