MUMBAI, India, March 28 -- Intellectual Property India has published a patent application (202517020632 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on March 7, for 'electronic device comprising structure for dissipating heat generated in electronic device.'
Inventor(s) include Lee Junghoon; Kim Kangsik; Rhee Bongjae; Kang Dongku; Kim Jihong; and Moon Hongki.
The application for the patent was published on March 28, under issue no. 13/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to an embodiment comprises: a hinge structure including a first hinge plate a second hinge plate and a hinge bracket; a display; a plurality of reinforcement members includi...