MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517050989 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on May 27, for 'electronic device comprising structure for dispersing heat.'
Inventor(s) include Kang, Seunghoon; Kwon, Ohhyuck; Park, Yoonsun; Park, Jongkil; Sung, Jungoh; Son, Changjong; and Yun, Hajoong.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "An electronic device according to one embodiment may comprise: a printed circuit board; a processor on the printed circuit board; a vapor chamber which is spaced apart from the printed circuit board, and of which...