MUMBAI, India, May 9 -- Intellectual Property India has published a patent application (202517037480 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on April 17, for 'electronic device comprising hinge assembly.'
Inventor(s) include Lee, Sangchul.
The application for the patent was published on May 9, under issue no. 19/2025.
According to the abstract released by the Intellectual Property India: "According to an embodiment of the present disclosure, an electronic device may comprise: first and second housings which are coupled pivotally about at least one folding axis between folded and unfolded states; a hinge assembly which pivotally connects the first and second housings to each other; a flexible display which i...